The Fielect Copper Clad Laminate is a double-sided copper clad boards used for PCB (Printed Circuit Board) circuit development and fabrication. The boards have a dimension of 180mm x 120mm (7.09″ x 4.72″) with a thickness of 1.5mm (0.06″). They are made from FR-4 glass fiber and copper materials, known for their high temperature resistance, resistance to oxidation, and durability. The boards are designed to mechanically support and electrically connect electronic components using conductive tracks, pads, and other features etched from copper sheets laminated onto a non-conductive substrate. They are suitable for various applications such as product development, DIY experiments, maintenance, and production. Despite potential transportation-related scratches or dirt, they do not affect the functionality of the boards. The Fielect Copper Clad Laminate offers cost-effective and reliable solutions for PCB circuit board fabrication with good circuit line performance and heat dissipation performance.